,
Call
Obudowa z tworzywa ABS
Pulpit, Wall VESA 75
Tworzywo sztuczne ABS
IP54
LCD TFT
7
800 x 480
400
600 : 1
LED
Resistive
Intel Atom E3825
1.33
DDR3L 1600
2
4
zintegrowany z procesorem
1
Tak
Tak
2
1
1
1xDB9, 1xRJ-45
1
1
1
1
tak
1
tak
tak
2
3xDigital In / 3xDigital Out
2
2
Zintegrowane głośniki, Line-Out
Zintegrowany mikrofon
Bez wentylatora /Fanless
1xHDD LED, Dioda LED zasilania, Wskaźnik awarii zasilania, WWAN LED
On/Off, 1xReset, Przyciski sterujące, Klawisze funkcyjne
DB9, RJ45, RJ45 Ethernet, 1xUSB, Mic In, Line Out, DC Input, SIM Card Slot, MicroSD card slot, DB15 Female
9 ... 36
Android, Windows Embedded Compact 7, Ubuntu
-20 ... 60
10 ... 90
Operating: MIL-STD-810G, 514.6 Procedure 1, Category 4; Storage: MIL-STD-810G, 514.6 Procedure 1, Category 24
Operating: MIL-STD-810G, Method 516.6, Procedure I, trucks and semi-trailers=20g; Crash hazard: MIL-STD-810G, Method 516.6, Procedure V, ground equipment=75g
213
145
50
CE, FCC Class B
MIL-STD-810G Test Method 514.6 Vibration, MIL-STD-810G Test Method 516.6 Shock
EN 60950-1
SAE J1113, SAE J1455, ISO 7637-2
NEXCOM